Electroless Copper Nano Thin Film Deposition Using Ecofriendly Natural Polyhydroxylic Compound

Abstract

Jayalakshmi Suseela, VenkateshPerumal and Balaramesh Palanivelu

Copper electroless plating using polyhydroxylic alcohol was studied electrochemically using Dimethylamineborane(DMAB) as reducing agent. Copper methanesulphonate bath was used with Glycerol as the complexing agent and Potassium hydroxide as pH adjuster. The electroless bath was optimized by addition of 1 ppm concentration of stabilizers at 11.50 ± 0.25 pH. Tolytriazole(TTA) and Cytosine(CYS) are used as stabilizers and their effects on plating bath were studied and reported. Surface morphologies of the electroless copper coated epoxy substrates were investigated using Scanning Electron Microscope (SEM) and surface roughness by Atomic Force Microscopic (AFM) analysis. Crystallite size and specific surface area of copper thin film were observed by X-ray diffraction (XRD). Electrochemical characteristics were studied by Cyclic Voltammetry (CV). The physical parameters of the deposition shows that TTA influenced the copper coating while the CYS does not show much effect.

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